Wafer scale processing of InGaAsP/InP lasers
作者:
Steven Dzioba,
J. P. D. Cook,
T. V. Herak,
S. Livermore,
M. Young,
R. Rousina,
S. Jatar,
F. R. Shepherd,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1994)
卷期:
Volume 12,
issue 4
页码: 2848-2851
ISSN:1071-1023
年代: 1994
DOI:10.1116/1.587203
出版商: American Vacuum Society
关键词: SEMICONDUCTOR LASERS;QUATERNARY COMPOUNDS;INDIUM COMPOUNDS;GALLIUM COMPOUNDS;PHOSPHIDES;ARSENIDES;WAFERS;OPTICAL COATINGS;ETCHING;ION BEAMS;SILICON;SILICON OXIDES;CVD;PLASMA SOURCES;TEMPERATURE EFFECTS;InP;(In,Ga)(As,P);Si;SiO2
数据来源: AIP
摘要:
Chemically assisted ion beam etching (CAIBE) and electron cyclotron resonance (ECR) plasma deposition have been used to etch and coat 1.3 μm InGaAsP/InP heterostructure lasers in full wafer form. Ar/Cl2CAIBE, using an ECR dual grid ion source, was used to etch 4 μm deep vertical (90°±0.5°), smooth facets at rates up to 1.3 μm/min. An integrated back facet monitor was simultaneously fabricated in the same heterostructure. High‐reflectivity Si/SiO2optical coatings were deposited on the etched facets by low‐temperature (<120 °C) ECR plasma deposition and selectively patterned by liftoff. Full wafer testing of the processed devices showed good uniformity (±3%) with laser threshold currents of 25 mA and a slope efficiency of 0.23 W/A at 25 °C and 0.11 W/A at 85 °C. Back facet monitor efficiency was 0.4 A/W over the whole temperature range.
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