Intraplane guided wave massive fanout optical interconnections
作者:
Ray T. Chen,
Michael R. Wang,
Tomasz Jannson,
期刊:
Applied Physics Letters
(AIP Available online 1990)
卷期:
Volume 57,
issue 20
页码: 2071-2073
ISSN:0003-6951
年代: 1990
DOI:10.1063/1.103944
出版商: AIP
数据来源: AIP
摘要:
One‐to‐30 guided wave optical interconnections are demonstrated at 632.8 nm using a highly multiplexed waveguide volume hologram. This technology is capable of providing intrachip and intrawafer optical interconnections. The theoretical limit of the fanout number is addressed and experimentally confirmed. The measured data show that the diffracted beams have an average diffraction efficiency of 2.3% with ±0.2% variation. The demonstrated results can save surface space of electronic chips and also provide a large fanout capability due to the high index modulation of the volume hologram. Further applications based on this technology are very promising. Head‐up display, high‐speed optical data bus, surface enhanced Raman spectrometer, and optical sensors are some of the attractive ones.
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