The rate of cw laser induced solid phase epitaxy in self‐implantation amorphized silicon has been measured by determining the dwell time required to regrow the entire amorphous layer at the center of a scanned laser beam. The measurement was performed in the annealing temperature range of 800–900 °C. The measured regrowth rates were about two orders of magnitude higher than those extrapolated from low‐temperature furnace annealing data.