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Role of the hydrogen plasma treatment in layer-by-layer deposition of microcrystalline silicon

 

作者: K. Saitoh,   M. Kondo,   M. Fukawa,   T. Nishimiya,   A. Matsuda,   W. Futako,   I. Shimizu,  

 

期刊: Applied Physics Letters  (AIP Available online 1997)
卷期: Volume 71, issue 23  

页码: 3403-3405

 

ISSN:0003-6951

 

年代: 1997

 

DOI:10.1063/1.120324

 

出版商: AIP

 

数据来源: AIP

 

摘要:

We have investigated the role of hydrogen in hydrogenated microcrystalline silicon (&mgr;c-Si:H) formation using hydrogen plasma treatments, in particular examining the possibility of subsurface reaction due to permeating hydrogen atoms, which leads to the crystallization of hydrogenated amorphous silicon (a-Si:H). It is demonstrated that the hydrogen plasma treatment ofa-Si:Hfilm on the anode using a cathode covered bya-Si:Hfilm, which is inevitably coated during the deposition period, gives rise to the deposition of&mgr;c-Si:Hover thea-Si:Hlayer, i.e., chemical transport takes place. It is also found that the pure hydrogen plasma treatment using a clean cathode induces only etching of thea-Si:Hlayer. These results imply that the present hydrogen plasma condition does not cause crystallization ofa-Si:Hbut only etching, and that careful experimentation is required to determine the real subsurface reaction due to atomic hydrogen. ©1997 American Institute of Physics.

 

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