Direct wafer bonding and layer transfer for ferroelectric thin film integration
作者:
M. Alexe,
St. Senz,
A. Pignolet,
D. Hesse,
U. Gösele,
期刊:
Integrated Ferroelectrics
(Taylor Available online 1999)
卷期:
Volume 27,
issue 1-4
页码: 205-211
ISSN:1058-4587
年代: 1999
DOI:10.1080/10584589908228469
出版商: Taylor & Francis Group
关键词: layer transfer;direct wafer bonding;metal-ferroelectric-silicon structures;interface trap density
数据来源: Taylor
摘要:
A novel fabrication process of ferroelectric-semiconductor heterostructures based ondirect wafer bonding(DWB) andlayer transferis proposed. Metal-ferroelectric-silicon (MFS) structures were fabricated by both layer transfer process and direct deposition of ferroelectric films onto Si. Detailed transmission electron microscope (TEM) investigations revealed that a direct wafer bonding and layer transfer process yields good quality ferroelectric/Si interfaces. Interface trap measurements show a large difference for MFS structures fabricated by bonding or by direct deposition, respectively. The trap density values were ranging from 2×1012cm−2eV−1for SBT/Si directly deposited to 4×1011cm−2eV−1for SBT/Si bonded interfaces.
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