A novel micromachined test structure has been used to measure the work of adhesion between polycrystalline silicon surfaces. The effects of several surface treatments, including a hydrogen- and an ammonium-fluoride-induced hydrogen termination and a hydrogen peroxide chemical oxidation, have been investigated with these test structures. A reduction in the average apparent work of adhesion by a factor of 2000 has been observed on theNH4F-treated surface compared to the oxide-coated surface. By using x-ray photoelectron spectroscopy and atomic force microscopy, the observed reduction is traced to the combined effect of the surface chemistry and topography. This work demonstrates that a hydrophobic, rough surface provides a significant reduction of the apparent work of adhesion in polysilicon micromachined devices. ©1997 American Institute of Physics.