Low‐Pressure Chemical Vapor Deposition of α‐Si3N4from SiF4and NH3: Nucleation and Growth Characteristics
作者:
Woo Y. Lee,
James R. Strife,
Richard D. Veltri,
期刊:
Journal of the American Ceramic Society
(WILEY Available online 1992)
卷期:
Volume 75,
issue 10
页码: 2803-2808
ISSN:0002-7820
年代: 1992
DOI:10.1111/j.1151-2916.1992.tb05508.x
出版商: Blackwell Publishing Ltd
数据来源: WILEY
摘要:
The crystal structure and surface morphology of Si3N4prepared by LPCVD were characterized as a function of processing conditions. Temperature was the most dominant variable which affected the coating microstructure. Strongly faceted crystalline Si3N4was deposited at temperatures above ∼ 1410°C. In the temperature range of 1300° to 1410°C, crystalline and amorphous phases were codeposited. The content of the crystalline phase rapidly decreased with decreased temperature. In this temperature range, the coating crystallinity was also influenced by kinetic factors such as deposition rate and reagent depletion. For example, Si3N4became more crystalline as the deposition rate was decreased by either decreasing the flow rate or increasing the NH3/SiF4molar ratio. At ∼ 1300°C, the coating surface appeared fully botryoidal, and the coatings were mostly amorphous. Changes in the orientation and size of Si3N4crystallites were parametrically documented. As the temperature was increased, the Si3N4grains generally became more preferentially oriented to the (102) and/or (l0l) wherel= 1,2,3,., directions. The average facet size increased with coating th
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