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Discussion on ``Comment on `Habit and morphology of copper precipitates in silicon'''

 

作者: S. M. Hu,   M. R. Poponiak,  

 

期刊: Journal of Applied Physics  (AIP Available online 1973)
卷期: Volume 44, issue 5  

页码: 2416-2416

 

ISSN:0021-8979

 

年代: 1973

 

DOI:10.1063/1.1662578

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The dislocation climb mechanism for the growth and morphology of copper precipitates in silicon, as proposed by Fiermans and Vennik, is questioned on a number of points. In particular, the regularity of the geometry of precipitate colonies, the variation in precipitate density within a colony, and the different morphologies of precipitates of various interstitial impurities in silicon are cited against the suitability of the mechanism.

 

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