Efficient pulsed laser removal of 0.2 &mgr;m sized particles from a solid surface
作者:
W. Zapka,
W. Ziemlich,
A. C. Tam,
期刊:
Applied Physics Letters
(AIP Available online 1991)
卷期:
Volume 58,
issue 20
页码: 2217-2219
ISSN:0003-6951
年代: 1991
DOI:10.1063/1.104931
出版商: AIP
数据来源: AIP
摘要:
Laser cleaning with pulsed ultraviolet and infrared lasers is successfully employed to remove particulate contamination from silicon wafer surfaces and from delicate lithography membrane masks. Particulate material investigated include latex, alumina, silicon, and gold. Gold particles as small as 0.2 &mgr;m can be effectively removed. This new and highly efficient laser cleaning is achieved by choosing a pulsed laser with short pulse duration (without causing substrate damage), and a wavelength that is strongly absorbed by the surface; the removal efficiency is further enhanced by depositing a liquid film of thickness on the order of micron on the surface just before the pulsed laser irradiation.
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