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1. |
Preface |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 481-481
Maung S. Htoo,
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ISSN:0032-3888
DOI:10.1002/pen.760140702
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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2. |
Photochemistry in the solid phase |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 482-486
J. E. Guillet,
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PDF (469KB)
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摘要:
AbstractClassical photochemistry is an ancient branch of chemistry, but in the past its practitioners have restricted their interest primarily to studies in the gas or liquid phases. However the practical applications of photochemistry in recent years have led to an increasing interest in photoreactions which occur in the solid phase, particularly in polymeric systems. One of the first areas of practical interest has been in stabilizing plastic and other polymeric systems against photodegradative reactions initiated by solar radiation. More recently photoreactions in polymers have been used extensively in recording and reproducing photographic and other images.
ISSN:0032-3888
DOI:10.1002/pen.760140703
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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3. |
Photocrosslinkable polyphosphonates having unusual resistance to acids |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 487-490
Douglas G. Borden,
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PDF (369KB)
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摘要:
AbstractThe resistance of various linear condensation polymers to acid or base hydrolysis is dependent upon the nature of the linkages in the polymer chain. Aryl polysulfonates having a styrylketone sensitizing group have been shown to be particularly resistant to attack by strong bases. Similar phosphorouscontaining polymers have been prepared and those with the arylphosphonate, thiophosphonate, and phosphate linkages have been found resistant to attack by such acids as ferric chloride. Using a solution polymerization method, these phosphorous polymers and also those containing the phosphite, phosphonite, and phosphorane linkages may readily be prepared. A comparison has been made of the resistance of these polymers and of the corresponding polycarbonates, polysulfonates, and polyesters to various bases and to ferric chloride solutions.
ISSN:0032-3888
DOI:10.1002/pen.760140704
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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4. |
Azide photoresists for projection photolithography |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 491-493
N. J. Clecak,
R. J. Cox,
W. M. Moreau,
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PDF (260KB)
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摘要:
AbstractThe spectral sensitivity of bisazide sensitized rubbers has been extended to 5000Å by the addition of p‐azidocinnamylidene derivatives of cyclohexanone. The photoresists were suitable for projection exposure at 4050 and 4350 Hg lines. The photospeed of the compositions is enhanced by increasing the unsaturation of the polymer component. Speed increase could also be obtained by exposure of the films at elevated temperatur
ISSN:0032-3888
DOI:10.1002/pen.760140705
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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5. |
Mechanism of refractive index increase in photosensitized poly(methyl methacrylate) |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 494-497
M. J. Bowden,
E. A. Chandross,
I. P. Kaminow,
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摘要:
AbstractPoly(methyl methacrylate) prepared under special circumstances exhibits a substantial increase in refractive index after irradiation with ultraviolet light. The essential step in the preparation is peroxidation of the monomer prior to polymerization. This increase in refractive index results from a photo‐induced polymerization of unreacted monomer (1‐2 percent) within the film which produces an increase in density (and hence refractive index) in the irradiated region. It is believed that peroxides, both polymeric and monomeric, act as photoinitiators. Sensitivity depends on the concentration of photoinitiator but the absolute value of Δndepends on the amount of unreacted mon
ISSN:0032-3888
DOI:10.1002/pen.760140706
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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6. |
Computer simulation study of images in contact and near‐contact printing |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 498-508
B. J. Lin,
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PDF (2617KB)
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摘要:
AbstractVersatile computer programs capable of simulating near‐contact images from arbitrary objects and illumination were reported. Their capability was demonstrated in examples of combinations of different types of object and illumination. From the specific examples, we were able to derive certain general rules: (1) Polychromatic illumination is always better than monochromatic illumination. (Besides observing the examples given above, polychromatic illumination also helps when standing waves in photoresist are considered.) (2) Negative masks are easier to print than positive ones. Note that a negative mask in the sense of optical diffraction means smaller dimension for transparent parts of the mask. (3) Some well designed irregularities in the mask pattern improves the image. (4) The effective depth tolerance is between the limits set by the focussing effect and the image spreading effect. (5) Holographic mask should relax flatness and exposure toleranc
ISSN:0032-3888
DOI:10.1002/pen.760140707
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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7. |
Flash exposure system for thin photoresist films |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 509-512
D. E. O'Hora,
W. F. Beuschel,
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PDF (327KB)
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摘要:
AbstractThe formation of an image in a photoresist during photolithographic processing requires the exposure of the photoresist through a mask to a light source in the spectral region to which the photoresist is sensitive. The functional advantage of the flash exposure of photoresist is presented, which includes the elimination of oxygen effects, the reduction of diffraction and standing wave effects, and the enhancement of pattern‐edge acuity. The effects of both broad and narrow band sources are also shown with emphasis on proximity printing techniques. Finally, the optical, electrical and physical design parameters for a practical flash exposure system are discusse
ISSN:0032-3888
DOI:10.1002/pen.760140708
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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8. |
Epoxy photopolymers in photoimaging and photofabrication |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 513-515
Sheldon I. Schlesinger,
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PDF (320KB)
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ISSN:0032-3888
DOI:10.1002/pen.760140709
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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9. |
Electron beam processing systems (a state of the art review) |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 516-517
M. Hatzakis,
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PDF (199KB)
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摘要:
AbstractThis paper presents a review of electron‐sensitive resists evaluated for electron beam exposure. This includes positive as well as negative resists and their relative merits and drawbacks. The paper also presents general guidelines that can be used in evaluating any electron resist system for performance and usefulness in electron beam microfabricatio
ISSN:0032-3888
DOI:10.1002/pen.760140710
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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10. |
The interaction of 5 KeV electrons with polymers of methyl isopropenyl ketone |
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Polymer Engineering&Science,
Volume 14,
Issue 7,
1974,
Page 518-524
Aaron W. Levine,
Michael Kaplan,
Eugene S. Poliniak,
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PDF (730KB)
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摘要:
AbstractPoly(methyl isopropenyl ketone) (PMIPK) degrades upon exposure to 5 keV electrons. Using a scanning electron microscope to expose fine‐line raster patterns in thin films of this polymer and subsequently solvent‐developing the thus‐degraded regions, sharp walled troughs are observed, the width of which is a measure of the sensitivity to degradation. Copolymers with several vinyl monomers were prepared and the sensitivities of these were similarly determined. Information relevant to the mechanism of depolymerization was obtained by comparing homopolymers with copolymers and by the use of additives in the irradiated polymer films. Examples of potential device‐fabrication techniques using PMIPK resist ar
ISSN:0032-3888
DOI:10.1002/pen.760140711
出版商:Society of Plastics Engineers, Inc.
年代:1974
数据来源: WILEY
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