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1. |
Modelling Of Heat Transfer From Fluid Sources Using The Tlm Technique |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 96-100
PulkoS.H.,
OlashoreA.O.,
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摘要:
AbstractThis paper describes the modelling of heat transfer from stationary and rapidly moving fluids by the transmission line matrix (TLM) method. Results obtained are compared with those derived from finite element analysis.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760078
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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2. |
Computer Simulation Of Bi-And Tri-Level Interconnection Capacitances On Gaas-Based Vlsi |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 101-106
GoelA.K.,
LiC.R.,
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摘要:
AbstractWe have carried out a computer simulation of the parasitic capacitances associated with the bi-level and tri-level high density Interconnections on the GaAs-based VLSI. The ground and coupling Interconnection capacitances have been determined by the method of moments in conjunction with a Green’s function appropriate for the geometry of the interconnections. The Green’s function was obtained by using the method of multiple images. The results include the fringing fields as well as the shielding by the neighboring interconnections. The algorithms have been used to study the dependences of the interconnection parameters, such as their length, width, separation and the interlevel distances.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760079
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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3. |
Ambient Temperature Statistical Models For Environmental Studies |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 107-112
KovalDon,
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摘要:
AbstractOne of the key random variables which characterizes an environment is Its ambient temperature. The statistical patterns and the magnitude of the variable significantly affect society’s activities. One of the difficulties in practice is to construct a statistical model to represent the leve Is of ambient temperature. Based on the hourly recorded ambient temperature levels recorded for a period of one year, this paper presents its findings that the Pearson Family of Curves provides a reasonable statistical fit for the ambient temperature during certain periods in the year. The generalized methodology (i.e.,“Method of Moments”) which is the basis of the Pearson Family or Curves, was applied in this paper and provided a systematic computerized method for statistically modelling the ambient temperature data base without any a priori assumptions as to what statistical distribution bests represents the data base being Investigated. A detailed discussion of this statistical modelling technique and a comparison with other techniques and their references Is presented in this paper.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760080
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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4. |
Reliability And Availability Modelling Of Complex Behavior Of Computer Systems |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 113-117
ElbertM.,
WeyantT.,
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摘要:
AbstractIncreased system complexity, changes in technology, complex interaction between reliability and performance of systems, and complex system behavior require a systematic approach to provide accurate analysis and prediction of system reliability and availability. The paper presents basic concepts, approaches, and features of the modelling for complex availability and reliability processes of computer systems utilizing Markov Models. Among the basic items of discussion are combinations of different types of failures, coverage, transition-reconfiguration processes, and repair dependencies. The paper focuses on the practical aspects of modelling and the interpretation of the results of analysis, which can be applied to a large class of fault-tolerant systems and local area networks.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760081
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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5. |
Computer-Aided Vlsi Circuit Reliability Assurance |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 118-123
JayWen,
SheuBing,
TyreeVance,
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摘要:
AbstractHigh-quality microelectronic systems must be made of high-performance and reliable VLSI circuits. In an integrated circuit, not every transistor or interconnect line receives the same amount of electrical/environmental stress. The effective electrical stress received by each device is a complicated function of the device location, voltage/current duties cycle at device terminals, and circuit noise margin. An integrated circuit may become inoperative due to the failure of some critical device. The circuit lifetime can be greatly enhanced by releasing the intensive stress applied to those weak devices through innovative design techniques and the establishment of proper design rules in circuit layout generation. In this paper, a novel computer-aided design tool and its associated circuit-level degradation models for VLSI products are presented. Experimental results are included for hot-carrier induced damage effects. Extension of the computer program to include electromigration effects is addressed.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760082
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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6. |
Analysis Of Systems With Human Errors And Common-Cause Failures |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 124-128
DhillonBalbir,
RayapatiSubramanyam,
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摘要:
AbstractThis paper presents two newly developed mathematical models to perform human error and common-cause failure analysis of redundant systems with a partially energized standby unlt. System reliability, steady state availability, mean time to failure, and variance of time to failure formulas are developed. Several plots are shown to demonstrate the effect of increasing human error and commoncause failure rates on system reliability, availability, and mean time to failure.
ISSN:0228-6203
DOI:10.1080/02286203.1989.11760083
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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7. |
New Publications: Conferences |
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International Journal of Modelling and Simulation,
Volume 9,
Issue 4,
1989,
Page 129-129
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ISSN:0228-6203
DOI:10.1080/02286203.1989.11760084
出版商:Taylor&Francis
年代:1989
数据来源: Taylor
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