Journal of Vinyl Technology


ISSN: 0193-7197        年代:1989
当前卷期:Volume 11  issue 3     [ 查看所有卷期 ]

年代:1989
 
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1. Government regulations into the '90s
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  109-110

Lewis B. Weisfeld,  

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2. Coated metals compatible with PVC jackets for bonded sheath cable applications
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  111-114

K. E. Bow,   D. G. Pikula,   B. K. Grosser,   P. B. Leng,  

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3. Market development of PVC mineral water and wine bottles in western europe: Current status and projections for the future
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  115-120

V. K. Sahajpal,  

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4. Influence of physical aging on medical plastics properties
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  121-124

L. Woo,   Y. W. Cheung,  

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5. Sintering of PVC
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  125-128

G. Crolla,   G. Menges,  

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6. Scanning electron micrograph study of the impact‐improved MBS/PVC blends
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  129-132

D.‐M. Fann,   H.‐Y. Shih,   C.‐M. Hsiao,   S. K. Huang,  

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7. Odor and PVC: Identification and quantification of volatiles in clear polyvinyl chloride processing
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  133-136

T. H. Lemmen,   G. M. Conroy,   P. A. Bautista,  

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8. Product liability—who pays for it?
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  137-140

R. Gregory,  

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9. Reaction between HC1 and orthophthalates of lead in hot DOP without PVC, and stabilization in plasticized PVC
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  141-150

E. W. J. Michell,   D. Shah,  

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10. Practical interpretation of laboratory die swell behavior of PVC extrudates—through correlating circular with non‐circular die performance
  Journal of Vinyl Technology,   Volume  11,   Issue  3,   1989,   Page  151-156

P. R. Van Buskirk,  

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