摘要:

We report the growth on polycrystalline yttria‐stabilized zirconia substrates of YBa2Cu3O7−xfilms withJc(77 K)=11 000 A/cm2andJc(4.2 K)=122 000 A/cm2by pulsed laser ablation. TheseJcvalues are among the highest reported for YBa2Cu3O7−xon any polycrystalline substrate and approach the intrinsic upper limit for films with large‐angle grain boundaries, as indicated by recent bicrystal experiments. We find that the substrate temperature during film growth is most important in obtaining highJcpolycrystalline films. Although the magnetic field dependence ofJcindicates the presence of weak links, the behavior ofJc(4.2 K,H) suggests that a percolative path consisting of low‐angle grain boundaries exists in the films, resulting inJc(4.2 K, 60 kOe)=4100 A/cm2.

ISSN:0003-6951    

DOI:10.1063/1.104226

出版商:AIP    

年代:1990

数据来源: AIP

摘要:

Recent experimental results have indicated that the traditionally conceived role of copper in Al/Cu alloys in electromigration resistance may not be correct. A simple model is proposed based on Al/Cu intermetallic precipitates acting as local diffusion barriers limiting vacancy availability.

ISSN:0003-6951    

DOI:10.1063/1.103518

出版商:AIP    

年代:1990

数据来源: AIP

ISSN:0003-6951    

DOI:10.1063/1.104289

出版商:AIP    

年代:1990

数据来源: AIP