Journal of Applied Physics


ISSN: 0021-8979        年代:1974
当前卷期:Volume 45  issue 1     [ 查看所有卷期 ]

年代:1974
 
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21. Cryogenic thin‐film electron emitters
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  119-125

David G. Onn,   P. Smejtek,   M. Silver,  

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22. Temperature as a mechanism for the buildup of successive streamers in low‐voltage breakdown
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  126-134

John M. Geary,   Gaylord W. Penney,  

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23. Phase transformation in bismuth under shock loading
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  135-139

J. P. Romain,  

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24. Temperature deposition caused by shock interactions with material interfaces
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  140-145

P. A. Urtiew,   R. Grover,  

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25. Thermal relaxation at interfaces following shock compression
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  146-152

R. Grover,   P. A. Urtiew,  

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26. Structure and dc electrical properties of a Au&sngbnd;Rh‐glass thick‐film system
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  153-160

J. W. M. Biesterbos,  

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27. Electron‐irradiation effect in the Auger analysis of SiO2
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  161-166

Simon Thomas,  

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28. Compaction of ion‐implanted fused silica
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  167-174

Errol P. EerNisse,  

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29. Energy‐level structure and carrier transport in the poly(N‐vinyl carbazole): trinitrofluorenone charge‐transfer complex
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  175-178

J. Mort,   R. L. Emerald,  

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30. Measurement of the thermal diffusivity of mercury
  Journal of Applied Physics,   Volume  45,   Issue  1,   1974,   Page  179-181

C. S. Ang,   S. L. Chan,   H. S. Tan,  

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