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| 81. |
Comment on ‘‘Steady‐state temperature profile for a thin‐film resistor under bias’’ [J. Appl. Phys.72, 3862 (1992)] |
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Journal of Applied Physics,
Volume 74,
Issue 8,
1993,
Page 5290-5290
Yong‐Feng Lu,
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PDF (121KB)
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摘要:
This comment is to point out that the temperature dependence of the thermal conductivity should be taken into account in computing the temperature distribution in substrate material (such as silicon) with temperature‐dependent thermal conductivity. Ignoring the temperature dependence of the thermal conductivity will lead to a large error in the calculated results.
ISSN:0021-8979
DOI:10.1063/1.355308
出版商:AIP
年代:1993
数据来源: AIP
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| 82. |
Response to ‘‘Comment on ‘Steady‐state temperature profile for a thin‐film resistor under bias’ ’’ [J. Appl. Phys.74, 5290 (1993)] |
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Journal of Applied Physics,
Volume 74,
Issue 8,
1993,
Page 5291-5291
Roya Sabeti,
E. M. Charlson,
E. J. Charlson,
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PDF (42KB)
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摘要:
Although the thermal conductivities of silicon and silicon dioxide do vary with temperature, minimal change would result from a temperature rise of 50 °C, from room temperature to 350 °C. as is the case in the application in question.
ISSN:0021-8979
DOI:10.1063/1.354251
出版商:AIP
年代:1993
数据来源: AIP
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