ISSN:1050-1827    

DOI:10.1002/mmce.4570050202

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

ISSN:1050-1827    

DOI:10.1002/mmce.4570050203

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractMany different procedures have been proposed for the finite element analysis of dielectric‐loaded waveguiding structures. However, most of these approaches are unreliable because of the appearance of spurious modes. Mixed‐order covariant projection finite elements have been shown to eliminate difficulties with spurious modes in vector waveguide formulations. The authors have developed a method to analyze open region dielectric‐loaded waveguiding problems using mixed‐order covariant projection finite elements. Details of the construction of the eigenvalue equation are presented. The treatment of open geometries using local absorbing boundary conditions is discussed. An efficient sparse eigensolver, based on iterative methods, that can solve the resulting nonlinear eigenvalue problem, is described. Analysis results are presented that demonstrate the ability of the formulation to solve for the propagating modes of open microstrip lines without the appearance of spuriou

ISSN:1050-1827    

DOI:10.1002/mmce.4570050204

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractIn this article, the capacitance matrices of three‐dimensional conducting structures embedded in a stratified dielectric medium are computed by using the fast muitipole method in conjunction with a closed‐form approximation of the appropriate Green's function. Image charges that result from the employment of this Green's function are incorporated into the fast multipole method. This technique is used to accelerate the iterative generalized minimal residual‐based solution of the system of equations generated by the method of moments. This yields the charge distributions on the conductors and thereby the required capacitance matrix. It is shown that the use of this technique typically results in a speedup of more than an order of magnitude over iterative and direct methods without a compromise of the numerical acc

ISSN:1050-1827    

DOI:10.1002/mmce.4570050205

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractDifferent simulation methods for analyzing microwave interconnects are presented. Dynamic and static as well as two‐dimensional (2D) or three‐dimensional (3D) methods are investigated, such as the method of moments (MoM), the SDM, and TLM method, in their specific domains of predilection. Results are finally compared together with those obtained from a commercial software product based on the FEM method. © 1995 John Wiley&Sons,

ISSN:1050-1827    

DOI:10.1002/mmce.4570050206

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractA general methodology for modeling packages using the three‐dimensional (3D) TLM method is presented. S parameters are calculated from reflected and transmitted signals, and electrical parameters of equivalent networks are extracted. Frequency domain results (up to 30 GHz) are presented for a microstrip right‐angle bend, a cross junction, and vias. The purpose of this article is to demonstrate the possibilities of using the 3D TLM method for electrical modeling in packaging applicati

ISSN:1050-1827    

DOI:10.1002/mmce.4570050207

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractThis article introduces a CAD‐oriented functional model of the microwave FET depending on temperature as an additional state variable in addition to the usual gate and drain voltages. The model is fully conservative and non‐quasistatic, and thus considerably more advanced than other currently available empirical models. A novel parameter extraction strategy allows the simultaneous determination of the voltage and temperature dependence of the constitutive relations, making use of a set of DC measurements and bias‐dependent scattering matrices obtained at a single ambient temperature. The model can be coupled to a harmonic‐balance algorithm for the efficient electrothermal simulation of temperature‐dependent nonlinear microwave circuits, which the authors discussed in a previou

ISSN:1050-1827    

DOI:10.1002/mmce.4570050208

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

摘要:

AbstractA hybrid edge element approach for the computation of waveguide modes is presented. The electric field is decomposed into its transverse and longitudinal components, which are modeled in terms of two‐dimensional edge elements and scalar nodal elements, respectively, thereby satisfying the Dirichlet boundary condition at the perfect electric conductor boundaries and dielectric interfaces. Failure to do so results in the generation of spurious modes. This approach allows for the modeling of a three‐dimensional field quantity over a two‐dimensional boundary, namely the waveguide cross section. Another approach, the method of moments, serves as an excellent means of verifying the results obtained through use of hybrid edge elements. A comparison of the results obtained from both techniques are presented, along with the associated field plots obtained from the hybrid edge element approach for several geome

ISSN:1050-1827    

DOI:10.1002/mmce.4570050209

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

ISSN:1050-1827    

DOI:10.1002/mmce.4570050210

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY

ISSN:1050-1827    

DOI:10.1002/mmce.4570050201

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1995

数据来源: WILEY