ISSN:0748-8017    

DOI:10.1002/qre.4680020402

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractQuality is an important business strategy in the economic and technological environment of today. To achieve high product quality, it is important to take explicit account of the cost of quality, and to use this cost as another management control. A new direction for achieving a cost‐effective quality management system is to design statistical process controls so as to directly incorporate quality costs. This paper discusses the major approaches to the economic design of statistical process controls, and compares several different model formulations. The practical implication of these techniques is stressed. In particular, two economic models of the chart are presented: a full economic model requiring a user‐specified process and nine cost parameters, and a semi‐economic model using five user‐specified parameters. Both of these could serve as approaches to reducing the total cost of process control. Because of its simplicity in application the semi‐economic model should gain greater acceptance by practitioners for the design of process control t

ISSN:0748-8017    

DOI:10.1002/qre.4680020403

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractThis paper compares the reliability of four surface mount package styles with the standard through‐hole package. Three test boards were fabricated and subjected to environmental and electrical stresses. The relative package performances of SOICs, butt‐soldered DIPs, surface mounted DIPS, and through‐hole DIPs were found to be equal when subjected to stresses exceeding those expected in normal use. PLCC packages were found to be slightly less reliable in humidity environments than the other pac

ISSN:0748-8017    

DOI:10.1002/qre.4680020404

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractThe simplified techniques presented in this paper are the result of a study*of specific stand‐by system configurations comprised of combinations of two different types of non‐repairable operating parts. Failed parts of either type are replaced with stand‐by parts of just one of the two types. All parts have constant failure rates. The simplified transition probability diagram technique centres on the transition probability diagram and is here applied to one of seven system configurations of the original study. To validate the transition probability diagram technique an expanded Markov flow graph is used. Both of these simplified techniques offer advantages over other, existing techniques. A single, general mean time to failure (MTTF) equation is obtained for all the configurations analysed. The developed techniques were used in the analysis of an actual electrical system design pr

ISSN:0748-8017    

DOI:10.1002/qre.4680020405

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractWeibull paper is used extensively to estimate the parameters of a population, even when the results may look somewhat suspicious to the eye. In this paper the author suggests a statistical test, gives the limiting values of the test statistic, and goes on to illustrate the use of such a test by analysing some data.

ISSN:0748-8017    

DOI:10.1002/qre.4680020406

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractInvestigation into the failures of input modules at functional testing after assembly revealed unique damage to the emitters of the bipolar custom integrated circuit used as a receiver. Using a form of reverse engineering revealed that the damage could only be produced by a high energy pulse of short duration. Simulating the input circuit using discrete devices confirmed that similar circuit structures with the same applied stresses gave identical results. It was found that an energy level of 275 μJ gave a similar type of damage to that observed from the assembly failures.The mechanism of failure had to explain why this unique damage was produced at random on any one of four input transistors together with the occasional failure (around one in ten) which did not show this type of damage. This type of failure was traced to short circuits breaking down the insulation oxide to supply lines underlying the input track. Because the damage to the emitters of the input transistors could only be produced by pulsing the discharge from input to input, it was concluded that the damage could be electrostatic in nature. When electrostatic protection precautions were introduced at the delivery of the circuit modules and the earlier assembly stages of the equipment, these failures were totally eliminated

ISSN:0748-8017    

DOI:10.1002/qre.4680020407

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractThe arguments for and against burn‐in are discussed. Conclusions are made on likely future requirements for burn‐in systems for integrated circu

ISSN:0748-8017    

DOI:10.1002/qre.4680020408

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractA physical model of the growth of chemically related failures in electronic components is developed. This model is used to demonstrate that time to failure is as much a function of the component geometry as it is of the activation energy of the reaction. Further interpretation suggests that for any specified failure mechanism the acceleration achieved in a high temperature stress environment will appear to be a variable. Finally, using a simulation technique, a statistical distribution of the times to fail can be generated which resembles very closely the classical exponential failure curve.

ISSN:0748-8017    

DOI:10.1002/qre.4680020409

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

摘要:

AbstractThe occurrence of electronic failures during high temperature stress testing, and their recovery at ambient, represents one of the most difficult problems of reliability assessment. This paper examines one such failure on a dynamic random access memory (DRAM) module and gives an analysis of its nature. In addition, a suggestion as to how to assess the impact of such failures in the field situation is given and its specific application to this problem used to make a field reliability prediction.

ISSN:0748-8017    

DOI:10.1002/qre.4680020410

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY

ISSN:0748-8017    

DOI:10.1002/qre.4680020411

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1986

数据来源: WILEY