ISSN:0748-8017    

DOI:10.1002/qre.4680090402

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractThis paper describes a new method for the analysis and optimization of reliability as an integrated part of the design process of electronic circuits. It bases itself on the analysis of the susceptibility of failure mechanisms in components as a function of the combinations of external stress factors (stressor‐sets). The paper describes the backgrounds of stressor‐susceptibility analysis, the need for this analysis and the way this method is used for high‐level design and optimization of electronic cir

ISSN:0748-8017    

DOI:10.1002/qre.4680090403

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractElectronic control units in automotive applications must meet most demanding quality and reliability requirements. Tomorrow's quality and reliability targets for complete electronic system units are at the same level as those for today's complex components in these units.The analysis of the present situation reveals the essential deficiencies. The required improvements must be based on early partnership of the component supplier and the system manufacturer at the design phase of components and systems, on matured and controlled processes at component and system manufacturing and on correct application of both components and systems.

ISSN:0748-8017    

DOI:10.1002/qre.4680090404

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractThe reliability of components in the equipment of France Telecom has been observed for many years. The computerized database SADE (field failure analysis system) will be described. Some examples of failure analysis on field returns of integrated circuits and optoelectronic devices will be given. Investigations permit the reliability prediction models for new components to be improved.

ISSN:0748-8017    

DOI:10.1002/qre.4680090405

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractThe content of this paper is based on the study published at ESREF 91 in Bordeaux under the title ‘Plastic Encapsulated IC's in military equipments: reliability prediction modelling’. The first paper introduced the theoretical aspects of plastic encapsulated IC reliability prediction modelling. This paper presents the results of statistical studies done to complete the model with numerical data. Dependence of failure rates on year of manufacturing, dependence of thermo‐mechanical failure rate on die diagonal, distribution of the quality of ICs in the market, and environment factor defect values are the principal topics addressed in this

ISSN:0748-8017    

DOI:10.1002/qre.4680090406

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractBuilding in reliability requires a translation of failures to designable parameters and optimization of these parameters. This paper presents a systematic approach to optimize the reliability of an IC, susceptible to electromigration, in its application.

ISSN:0748-8017    

DOI:10.1002/qre.4680090407

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractFundamental aspects of electromigration in Al‐lines of integrated circuits are reviewed, including vacancy diffusion, vacancy generation and annihilation. The latter processes give rise to the generation of mechanical stresses. Various models and computer simulations on electromigration are compiled and their influence on the parameters in Black's equations is discussed. The beneficial effect of a (111) texture is explained by the concomitant formation of a large number of tilt grain boundaries and the low diffusivity of atoms perpendicular to the tilt axis of these boundarie

ISSN:0748-8017    

DOI:10.1002/qre.4680090408

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractAn early resistance change measurement set‐up, using an AC bridge technique, has been developed, and measurements have been performed. Large sample‐to‐sample variations occur. The characteristic time for the resistance change curve is shorter for resistance increase (under current stress) than for resistance decay (during reco

ISSN:0748-8017    

DOI:10.1002/qre.4680090409

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractTungsten is widely investigated for contact and via filling to improve planarization and step coverage. Although many electromigration data are available on multilayered structures, very few studies have been carried out on W‐plug structures and mainly concern the vias. This paper investigates the electromigration performance of W‐plug contacts and underlines the main failure modes. A comparison is made with classical contacts and W‐plug vias, pointing out a new failure

ISSN:0748-8017    

DOI:10.1002/qre.4680090410

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY

摘要:

AbstractWe have developed an optical laser probe for the measurement of absolute surface temperature changes in integrated circuits. The experimental method is based upon thermoreflectance, which is the change in reflectance due to surface temperature changes of the device. A laser beam is focused upon a small spot of an operating circuit. The reflected intensity is recorded upon a photodiode in synchronism with the circuit periodic excitation signal. We calibrated the device by developing a simple analytical model to calculate the surface temperature behaviour of a silicon resistive structure we tested. The value we derived for the relative reflectance temperature coefficient of silicon is in excellent agreement with the value from the literature. The results show the laser probe to be a fast surface thermometer (DC to 10 MHz), with excellent lateral resolution (1 μm), with high sensitivity (10−3°C) and large dynamics (ΔT: 102to 10

ISSN:0748-8017    

DOI:10.1002/qre.4680090411

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1993

数据来源: WILEY