ISSN:0748-8017    

DOI:10.1002/qre.4680100502

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThis note is a short tutorial overview on the standardization activities of interest for testing, together with an overview on the role of testing in the European open market. Activities and problems are listed and discussed. A number of reliability and test standards are listed.

ISSN:0748-8017    

DOI:10.1002/qre.4680100503

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThe objectives of this paper are to propose a practical procedure for knowledge‐based reliability qualification, and provide a checklist of required information for qualification analysis and testing. The paper investigates the common failure mechanisms of electronic components in automotive environments, and addresses the role of physics‐of‐failure approach in component reliability qualific

ISSN:0748-8017    

DOI:10.1002/qre.4680100504

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThis paper covers practical test concerns such as proper test design and analysis of data. It will speak to software and hardware testing as well as test design techniques such as design of experiments. Reliability and test terminology will be given. Some test lessons learned will be shared.

ISSN:0748-8017    

DOI:10.1002/qre.4680100505

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractBased on analysis of field reliability information a reliability model proper for engineering is developed and demonstrated. The development of the model is performed by applying the well known but often forgotten scientific method in which theoretical models are continuously compared with observations and subsequently modified/further developed until a reasonable consistency has been achieved. The tools used are by no means advanced. The model presented has been applied successfully in many industrial case studies, one of which will be described in the paper.

ISSN:0748-8017    

DOI:10.1002/qre.4680100506

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThis paper presents the best compromise three‐level constant stress accelerated life test plans for Weibull distributions with different censoring times. The best compromise test plans choose the stress levels, test units allocated to each stress and censoring times to simultaneously minimize the asymptotic variance of the MLE of the mean log life at design stress and total running time. This paper also compares the test plans with existing three‐level test plans and concludes that the best compromise test plans (1) have less asymptotic variances, (2) are more robust and (3) are more cost‐effective, than the existing three‐level tes

ISSN:0748-8017    

DOI:10.1002/qre.4680100507

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThe background of ‘Goh's paradox’ in connection with the application of the common version of Genichi Taguchi's parameter design routine is examined. A detailed case study is used to show how the paradox can be resolved, as well as to assess the probability of success of marginal analysis in Taguchi's prescribed procedure for quality and reliability improvem

ISSN:0748-8017    

DOI:10.1002/qre.4680100508

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractEnvironmental issues have an ever‐increasing influence on the selection of material and processes in electronic manufacturing. This paper discusses the use of conductive adhesives as a replacement for solder on SMT printed circuit boards. As a result of a world‐wide market survey, a number of conductive adhesives has been selected. One of the two key issues of this paper has been to uncover the market for adhesive types and their composition. The other key issue has been the technical investigation of the influence of component termination and printed circuit surface types on adhesive bonding stability. Four different types of adhesives on two different metal surfaces are compared with conventional solder technology. Each adhesive has been applied to the PCBs by either screen printing or dispensing according to the manufacturer's recommendation, followed by curing. All PCBs went through thermal and humidity cycling followed by electrical measurements of resistance. Finally all variants have been adhesion tested. All adhesive variants have been microsectioned for metallurgical and microstructure examination. Energy dispersive analysis of X‐ray (EDAX) of the metal particles in the adhesive has been carried out and documented. Rework of conductive joints is briefly commented on. Finally, aspects of occupational health are discussed concerning work with adhesive types. Work with epoxy based adhesives has been brought into special

ISSN:0748-8017    

DOI:10.1002/qre.4680100509

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

摘要:

AbstractThis is a description of a practical way to develop a new product with a built‐in robustness for many parameters. This has reduced the field call rate. The field call rate is measured using the superimposed renewal processM(t). This work has resulted in developing ‘stronger solder joints’ and it has also reduced the amount of resolder joints in PCB ass

ISSN:0748-8017    

DOI:10.1002/qre.4680100510

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY

ISSN:0748-8017    

DOI:10.1002/qre.4680100511

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1994

数据来源: WILEY