ISSN:0748-8017    

DOI:10.1002/qre.4680010202

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

ISSN:0748-8017    

DOI:10.1002/qre.4680010203

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractThe majority of discussions about the need for factory automation centre on productivity gains as the major justification. All too often the improvement of quality is forgotten or relegated to being an afterthought. This paper discusses reasons why quality should be a prime justification, and how the management of quality is likely to be achieved in an integrated electronics factory.

ISSN:0748-8017    

DOI:10.1002/qre.4680010204

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractThis paper is the first of what is intended to be a series of papers which investigate the foundations of reliability theory, particularly when applied to the prediction process. It will contrast current reliability practice against those practices common in normal science and engineering. The claim will be made that in general the prediction process as used in reliability, when stripped of the mathematical embellishments, is no more than simple enumeration: a method long held by the philosophers of science to be unreliable and in general a poor basis on which to make predictions.This initial paper rejects the statistical method as being an insufficient basis for making predictions and claims that it is incapable of logically supporting its conclusions. Although no evidence is provided to substantiate this claim, a number of scientific methods, both of historical and present day importance, are briefly reviewed with which one can contrast the statistical method.

ISSN:0748-8017    

DOI:10.1002/qre.4680010205

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractThe work described in this paper is part of a large, Government‐funded investigation into the usage of statistical methods of quality control (SQC) in British manufacturing industry. This paper reports the results of an investigation of fifteen firms which claimed in earlier work to be successful users of SQC. It is shown that six of the companies were in fact not regularly using recognized SQC techniques. Some general conclusions are drawn from the activities of these, and the remaining nine companies which were examined in detai

ISSN:0748-8017    

DOI:10.1002/qre.4680010206

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractProjects with a high software content are frequently completed late, with overrun costs and inadequate performance. Much of this is due to inadequate management, mainly caused by a lack of availability or knowledge of the criteria, methods and tools on which effective management should be based. Examples are given of the most frequent problems met by project managers. A plea is made for a vigorous effort to be made in developing management strategies which will allow the tools and techniques now being researched and developed to be used effectively for producing the high quality software needed for systems.

ISSN:0748-8017    

DOI:10.1002/qre.4680010207

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractThis article presents some details on how electrical and vibrational stresses exacerbate failures. This is one of a series of articles on similar subjects by this author. One electrical defect type is pin‐holes in oxide layers in ICs. Electrical leakage current through a low insulation pin‐hole could cause temperature rise and ultimately, when electrons of sufficient energy causing an avalanche, a thermal runaway condition could develop and maintain an electrical short. On the other hand electromigration could cause conductor opens. Aircraft data indicated that vibration related failures constituted more than 14 per cent of the total number of field failures. Fatigue failures can be directly related toS/Ncurves of stress to number of cycles to failure. Some measurements indicated that for a particular piece of equipment tested the time to failure varied inversely as the fourth power of vibrational acceleration; and failures of specific groups of component part types were sensitive to particular vibrational acceleration levels. Much information exists that gives quantitative measures on how stresses exacerbate failures. However, there is still a big gap in the relationship between the engineering fundamentals and the failures experienced. The author urges the readers to join force to develop a new reliability engineering foundation based on relationships of defects, failure mechanisms and stresses from which future reliability predictions and reliability analyses can be conduc

ISSN:0748-8017    

DOI:10.1002/qre.4680010208

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractAn overview of the factors affecting the reliability of plastic‐encapsulated ICs in moisture environments is presented. Particular attention is given to the moisture‐related failure mechanism EMA (electrolytic metal attack). The package design and process steps and techniques developed at RCA (through identification of the proper analytical models, thorough engineering programs, and by the statistical design of experiments) are detailed. Particular attention was paid to eliminating chlorides and their sources. The nature and state of ongoing plastic‐package moisture‐resistance programmes and future expectations are de

ISSN:0748-8017    

DOI:10.1002/qre.4680010209

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractElectrostatic discharge (ESD) was once considered a problem only for unprotected, insulated‐gate field‐effect transistors, but the ever shrinking geometries of all semiconductor devices have made them vulnerable to this phenomenon. ESD models and on‐chip device protection techniques are reviewed, together with current evidence concerning latent defects and their effect on device reliability. A brief discussion on the importance of ESD controls in the assembly environment is also included, with an emphasis on realistic cost‐effective measures. Finally, the impact of continued scaling on ESD vulnerability and protection structure limitations, are e

ISSN:0748-8017    

DOI:10.1002/qre.4680010210

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY

摘要:

AbstractThe total time on test (TTT) concept has proved to be a very useful tool in many reliability applications. In this paper we illustrate the usefulness of the TTT‐transform, a certain functional of the survival function, and an empirical counterpart called the TTT‐plot when analysing some different burn‐in models for both repairable and non‐repairabl

ISSN:0748-8017    

DOI:10.1002/qre.4680010211

出版商:Wiley Subscription Services, Inc., A Wiley Company    

年代:1985

数据来源: WILEY