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1. |
THERMAL CONDUCTIVITY OF LIQUID FOODS—A REVIEW |
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Journal of Food Process Engineering,
Volume 2,
Issue 4,
1978,
Page 283-306
ROBERTO CUEVAS,
MUNIR CHERYAN,
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摘要:
ABSTRACTTheoretical and semi‐empirical models for estimating the thermal conductivity (k) of liquid foods are reviewed. Seven models were considered; five, all containing temperature as an independent variable, were selected for their simplicity and apparent accuracy for further study and statistical evaluation. Experimental k values of 158 food samples, such as fruit and vegetable juices, sugar solutions, egg white and dairy products, were obtained from the literature. The model by Riedel (1949) described the data the best, producing the lowest standard error in the estimation of experimental values. Using thermal conductivity of water would give errors almost four times as much as if the Riedel model was used. These semi‐empirical models could also be used to estimate average k values in processes where temperature and/or solids content were varying. Theories of thermal conductivity applicable to liquid food systems were revie
ISSN:0145-8876
DOI:10.1111/j.1745-4530.1978.tb00212.x
出版商:Blackwell Publishing Ltd
年代:1978
数据来源: WILEY
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2. |
USE OF OPTICAL PROPERTIES OF FOOD MATERIALS IN QUALITY EVALUATION AND MATERIALS SORTING |
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Journal of Food Process Engineering,
Volume 2,
Issue 4,
1978,
Page 307-322
PICTIAW CHEN,
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PDF (752KB)
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ISSN:0145-8876
DOI:10.1111/j.1745-4530.1978.tb00213.x
出版商:Blackwell Publishing Ltd
年代:1978
数据来源: WILEY
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3. |
A COMPUTER‐THERMOCOUPLE INTERFACING SYS FOR TIME‐TEMPERATURE DATA COLLECTION FROM THERMAL FOOD PROCESSES1 |
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Journal of Food Process Engineering,
Volume 2,
Issue 4,
1978,
Page 323-336
RICHARD A. ROOP,
ARTHUR F. BADENHOP,
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PDF (531KB)
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摘要:
ABSTRACTA data logger that uses two computers simultaneously for collection and immediate observation of thermal food process data is described. Limits of error for a single observation, determined using a standard voltage input, was found to be less than .17° F (.094 °C). Component drift was found to be .04° F (.022° C) per hour. When properly calibrated, the system can be used for accurate data collection in most thermal process evaluati
ISSN:0145-8876
DOI:10.1111/j.1745-4530.1978.tb00214.x
出版商:Blackwell Publishing Ltd
年代:1978
数据来源: WILEY
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4. |
RHEOLOGICAL MODEL OF SOY DOUGH IN EXTRUSION |
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Journal of Food Process Engineering,
Volume 2,
Issue 4,
1978,
Page 337-342
A. H. CHEN,
Y. C. JAO,
J. W. LARKIN,
W. E. GOLDSTEIN,
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PDF (234KB)
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摘要:
ABSTRACTA viscosity model of defatted soy dough under various conditions of shear rate, temperature and moisture level in the extrusion process is reported. The model represents the data well within the shear rate range of 50 to 1,000 s−1, the temperature range of 100 °C to 160 °C, and the added moisture range of 22% to 32%. The flow index is determined to be 0.127, and response surfaces of the viscosity are also presen
ISSN:0145-8876
DOI:10.1111/j.1745-4530.1978.tb00215.x
出版商:Blackwell Publishing Ltd
年代:1978
数据来源: WILEY
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5. |
LITERATURE ABSTRACTS |
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Journal of Food Process Engineering,
Volume 2,
Issue 4,
1978,
Page 343-348
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PDF (337KB)
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ISSN:0145-8876
DOI:10.1111/j.1745-4530.1978.tb00216.x
出版商:Blackwell Publishing Ltd
年代:1978
数据来源: WILEY
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