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81. |
Factors affecting two-dimensional dopant profiles obtained by transmission electron microscopy of etchedp-njunctions in Si |
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Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Volume 16,
Issue 1,
1998,
Page 471-475
Suneeta S. Neogi,
David Venables,
Zhiyong Na,
Dennis M. Maher,
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PDF (450KB)
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摘要:
Transmission electron microscopy (TEM) was used to characterize image contrast obtained from doping-dependent etching ofp-njunctions in silicon. The local variations in crystal thickness give rise to the appearance of thickness fringes which may be interpreted as two-dimensional iso-concentration contours that map the dopant distribution. The samples used for the study consisted of solid source diffusions of boron into substrates of varying resistivities of bothn-andp-type. The factors which affect the interpretation of dopant profiles obtained from selective chemical etching of cross section TEM samples is addressed. One-dimensional chemical dopant concentration data were derived from secondary ion mass spectroscopy and one-dimensional carrier concentration data were derived from spreading resistance profiling.
ISSN:1071-1023
DOI:10.1116/1.589832
出版商:American Vacuum Society
年代:1998
数据来源: AIP
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82. |
Strong effect of dopant concentration gradient on etching rate |
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Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Volume 16,
Issue 1,
1998,
Page 476-480
V. A. Ukraintsev,
R. McGlothlin,
M. A. Gribelyuk,
Hal Edwards,
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PDF (84KB)
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摘要:
Dopant concentration sensitive etching of silicon inHF:HNO3:CH3COOHsolution was studied using epitaxially grown silicon samples. The study has shown the unstable character of the process, significant time and structure size dependencies of the etching rate, as well as the dependence of the rate on the dopant concentration gradient. The data may be rationalized on the basis of the electrochemical and autocatalytic nature of the reaction. The influence of the dopant gradient and overall device geometry on the etching rate may cause significant inaccuracy of the dopant distribution measurements.
ISSN:1071-1023
DOI:10.1116/1.589833
出版商:American Vacuum Society
年代:1998
数据来源: AIP
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