|
1. |
Editorial—Photosensitive polyimides |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 215-215
M. Kato,
T. Yamaoka,
R. Hurditch,
H. Honda,
Preview
|
PDF (84KB)
|
|
ISSN:1042-7147
DOI:10.1002/pat.1993.220040401
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
2. |
Recent advances in photosensitive polyimides |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 217-233
Hellmut Ahne,
Rainer Leuschner,
Roland Rubner,
Preview
|
PDF (2623KB)
|
|
摘要:
AbstractThe state of the art of photosensitive polyimides is reviewed with respect to the incorporation of photosensitivity into both polyimide precursors and soluble polyimides, for patterning in positive and negative modes. This paper emphasizes, in particular, the discussion of the performance of commercially available photosensitive polyimides with respect to their applications in electronics. The decisive properties, especially the patterning performance, and in the case of precursors the curing conditions, required to obtain full imidization, thermomechanical and electrical properties, solvent resistance and water uptake, as well as planarization of the commercially available materials, are compared with each other. An outlook presents the future demands on photosensitive polyimides.
ISSN:1042-7147
DOI:10.1002/pat.1993.220040402
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
3. |
Synthesis and mechanical properties of novel photosensitive polyimides |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 234-243
Dinesh N. Khanna,
Preview
|
PDF (736KB)
|
|
摘要:
AbstractThis paper surveys novel photoimageable polyimides (PHIMPI), with emphasis on synthesis. Details of the chemistry and synthesis techniques on PHIMPI are discussed. A number of associated issues such as swelling, storage stability, shrinkage, photospeed, solvent developability, moisture absorption, thermal expansion and mechanical properties are presented.Most of the photoimageable polyimides that are commercially suitable to date are negative‐acting, although recent developments in positive‐acting PHIMPI are inclu
ISSN:1042-7147
DOI:10.1002/pat.1993.220040403
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
4. |
A mechanism for the electron beam lithography of solvent‐soluble photosensitive polyimides |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 244-250
Takashi Yamashita,
Takafumi Kudo,
Kazuyuki Horie,
Preview
|
PDF (1229KB)
|
|
摘要:
AbstractSolvent‐soluble and intrinsically photosensitive polyimides were prepared, and their electron beam reaction was investigated. Negative tone patterns were formed by the electron beam irradiation of PI(BTDA/DEDPM) and PI(BEDA/DEDPM). The mechanism for the pattern formation of PI(BTDA/DEDPM) was determined from transient absorption measurements, changes in the molecular weights, and IR spectrum measurements to be crosslinking via hydrogen abstraction by the triplet excited state benzophenone moiety. For the case of PI(BEDA/DEDPM), the pattern was formed by insolubilization due to chemical change in the polymer. These reactions are found to be so inhomogeneous that insolubilization of the polymer occurs at an early stage of gelatio
ISSN:1042-7147
DOI:10.1002/pat.1993.220040404
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
5. |
Photosensitive polyimides for applications in electrical and optical interconnection technology |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 251-260
K. K. Chakravorty,
Preview
|
PDF (7283KB)
|
|
摘要:
AbstractThe application of photosensitive polyimides in electrical and optical interconnection technology is discussed. Critical properties of two photosensitive polyimide formulations with significantly different structural chemistries have been compared. Polyamic ester based formulations such as Selectilux® HTR3 show significant distortions in the photopatterned features upon high‐temperature baking, which can be ascribed to anisotropic shrinkage. A BTDA‐alkylated diamine based preimidized formulation (Probimide®), on the other hand, shows a more uniform shrinkage of the photopatterned features. HTR3 films interacts strongly with metals such as copper, which adversely affect the photopatternability of these materials. Planarization behavior in multiple layer structures has also been investigated. We explored the viability of these materials for applications in optical interconnection. Probimide® materials exhibit low scattering losses and appear to be promising candidates for the development of a MCM‐compatible optical interconnection technology. We also describe here a novel technique for optical recording of refractive index patterns in Probimid
ISSN:1042-7147
DOI:10.1002/pat.1993.220040405
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
6. |
Development and commercialization of ionic‐type photosensitive polyimides |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 261-267
Masaya Asano,
Masuichi Eguchi,
Kazutaka Kusano,
Katsuhiro Niwa,
Preview
|
PDF (1404KB)
|
|
摘要:
AbstractToray's ionic‐type photosensitive polyimide, “Photoneece”, is widely used as an interdielectric and as a protection layer for microelectronics, because of its properties, such as the removal of photoreactive groups at low temperature, excellent thermal, mechanical and electrical film properties and excellent adhesion to various substrates. Toray has developed a new type of “Photoneece”, UR‐5100, which is a low‐stress photosensitive polyimide. In addition to a low thermal expansion coefficient (25 ppm/°C), “Photoneece” UR‐5100 also features high resolution with an aspect ratio of more than 2.0 in 40 μm imaged film, and excellent mechanical properties in the cured film such as high elongation (>20%) and tensile strength (>200 MPa), even after 60 hr heat treatment at 350°C. “Photoneece” UR‐5100 can be applied in multichip modules (MCMs), hybrid circuits, ICs and LSIs. In this paper the characterization and processing of this “Pho
ISSN:1042-7147
DOI:10.1002/pat.1993.220040406
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
7. |
Negative‐type photosensitive polyimide precursors developable with aqueous alkaline solutions |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 268-276
H. Kikkawa,
F. Shoji,
J. Tanaka,
F. Kataoka,
H. Satou,
Preview
|
PDF (2081KB)
|
|
摘要:
AbstractNew photosensitive polyimide precursors developable with aqueous alkaline solutions were synthesized. Among diamine monomers having a photofunctional group, 2′‐(methacryloyloxy)ethyl 3,5‐diaminobenzoate yields high molecular weight polyamic acid. A photosensitive polymer composition consisting of Michler's ketone and a thermally stable peroxide, 3,3′,4,4′‐tetrakis(t‐butyldioxycarbonyl)benzophenone, results in a high photosensitivity of 200 J/m2. The photosensitive coating of the composition is soluble in aqueous alkaline solutions as well as in organic aprotic polar solvents, and both solvents can be used as developers. However, the resolution of patterns is quite different, especially in thick films. Solvent developers results in poor resolution, whereas aqueous alkaline developers give patterns of high aspect ratio even in thick films. This is probably due to the difference in the diffusion efficiency and swelling properties of the polymer compared to t
ISSN:1042-7147
DOI:10.1002/pat.1993.220040407
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
8. |
Photoreactive fluorinated polyimide protected by a tetrahydropyranyl group (THP) based on photo‐induced acidolysis |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 277-287
Toshihiko Omote,
Syun'ichi Hayashi,
Kazuhisa Ishii,
Kazuhiko Naitoh,
Tsuguo Yamaoka,
Preview
|
PDF (1324KB)
|
|
摘要:
AbstractA polyimide (6F‐THP) with a tetrahydropyranyl group (THP) in its side chain has been synthesized. The THP group exhibits a high acidolysis rate in this polymer's film. This rate was faster than that of a tertbutoxycarbonyl group (t‐BOC), which has been previously reported [1]. Furthermore, the deprotected fluorinated polyimide (6FDA‐AHHFP) became soluble in an aqueous base due to the presence of a hydroxyl group attached to the phenyl group of the diamine segment. The polyimide thus provides high performance as a photopolymer when used in conjunction with a photoacid generator after the post‐exposure baking process (PEB). The photoacid generators used in this study were p‐nitrobenzyl‐9,10‐dimethoxyanthoracene‐2‐sulfonate (NBAS) and diphenyliodonium‐9,10‐dimethoxyanthoracene‐2‐sulfonate (DIAS). The quantum yields of photodissociation and photoacid generation were also measured. The photoacid‐generating quantum yields closely corresponded to the photosensitivities of the photoreactive polyimide system. It was confirmed that the THP group was easily deprotected even in the 6F‐THP film with p‐toluenesulfonic acid as a model acid catalyst. The activation energy of the THP deprotection reaction was determined to be 12.8 kcal/mol (19.5 kcal/mol in the case of t‐BOC). The relationships between the THP deprotecting rate constant (kd) and acid molecular size and between kdand polyimide st
ISSN:1042-7147
DOI:10.1002/pat.1993.220040408
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
9. |
Positive photosensitive polyimides with cyclobutane structure |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 288-293
Toyohiko Abe,
Makoto Mishina,
Noriaki Kohto,
Preview
|
PDF (1165KB)
|
|
摘要:
AbstractA new family of positive photosensitive polyimide (PPI) systems composed of solvent soluble polyimides (Pls) with cyclobutane (CBDA) structures and diazonaphthoquinone compounds (DNQ) has been prepared. Heat and catalytic imidizations were carried out to obtain CBDA Pls; the former was better than the latter in controlling the molecular weight of the Pl. The OH groups in the Pls were easily acetylated during catalytic imidization, so COOH groups were selected as weak acidic groups in the Pls. The COOH groups were also effective in giving the Pls an alkaline solubility. Therefore, Pls having COOH groups were superior to those having OH groups for PPI systems. The photosensitive properties of various PPl systems containing COOH were found to vary with the fraction of COOH groups in the Pls, the content of DNQ in the systems, and the molecular weig
ISSN:1042-7147
DOI:10.1002/pat.1993.220040409
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
10. |
Photoreactive fluorinated polyimide protected by tetrahydropyranyl (THP) group based on chemical amplification: Acid generation in polyimide film and lithographic properties |
|
Polymers for Advanced Technologies,
Volume 4,
Issue 4,
1993,
Page 294-301
Kazuhiko Naitoh,
Kazuhisa Ishii,
Tsuguo Yamaoka,
Toshihiko Omote,
Preview
|
PDF (1763KB)
|
|
摘要:
AbstractThe photochemistry of photoacid generator (PAG), diphenyliodonium 9,10‐dimethoxyanthracene‐2‐sulfonate (DIAS) and diphenyliodonium 8‐anilinonaphthalene‐1‐sulfonate (DIANS) was investigated in both alkalinesoluble polyimide (6FDA‐AHHFP) and novolak films. The quantum yields of photodissociation of DIAS and DIANS in both 6FDA‐AHHFP and novolak films. The quantum yields of photodissociation of DIAS and DIANS in both 6FDA‐AHHFP and novolak films were determined as 0.11, 0.21, 0.12 and 0.26, respectively. On the other hand, the quantum yields for acid generation from DIAS and DIANS in both of these films were 0.07, 0.18, 0.09 and 0.22, respectively, in the presence of an acid indicator. These results indicate that the values of the quantum yields of photodissociation and photoacid formation for DIAS and DIANS in 6FDA‐AHHFP film are lower than those in novolak film. In order to elucidate the lowering of the quantum yields in 6FDA‐AHHFP film, fluorescence quenchings of sodium 9,10‐dimethoxy‐anthracene‐2‐sulfonate and ammonium 8‐anilinonaphthalene‐1‐sulfonate by a model compound of polyimide was carried out in acetonitrile. The fluorescences of these two salts were efficiently quenched by the model compound with the diffusion‐controlled rate constant in acetonitrile, suggesting that a strong electron‐accepting capability of the imide carbonyl group may hinder the electron transfer process within PAG molecules in 6FDA‐AHHFP film. Although a polyimide (6F‐THP) protected by tetrahydropyranyl group is insoluble in aqueous base, 6F‐THP film containing PAG became soluble in a 2:1 mixture of 2.0 wt% tetramethylammonium hydroxide (TMAH) and methanol by exposure to 365 nm light and successive post‐exposure baking (PEB) at 120°C for 10 min. The sensitivity and contrast of 6F‐THP with DIANS after the PEB conditions mentioned above were 110 mJ/cm2and 3.7, respectively. A high‐resolution pattern with a good profile was tr
ISSN:1042-7147
DOI:10.1002/pat.1993.220040410
出版商:John Wiley&Sons, Ltd.
年代:1993
数据来源: WILEY
|
|