ISSN:0947-076X    

DOI:10.1002/vipr.19950070102

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

ISSN:0947-076X    

DOI:10.1002/vipr.19950070103

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractPlasma deposition techniques are strongly required in high‐quality thin film production. In this paper an attempt is made to describe shortly fundamental properties of cold plasmas and to inform about their technical generation. The growing industrial applications of plasma in various PVD‐ and CVD‐technologies for coating and for surface cleaning as well as for chem. modification and structuring of surfaces and films are reviewed.Finally an example is given about plasma surface treatment of plastic car bumpers before lacqu

ISSN:0947-076X    

DOI:10.1002/vipr.19950070104

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractVarious effective and simple constructed plasma sources can be developed by using the hollow cathode effect. The improve of the plasma efficiency is caused by the penetration of two or more glow regions of different parts of the cathode. The equatation p × d ∽ 1 mbar cm is a rule of thumb for the appearance of the hollow cathode effect. The hollow cathode arc discharge is caused by an additional thermal electron emission besides the effectes of the hollow cathode glow discharge. All this effects are the reason for the higher degree of ionization for a hollow cathode source in comparison with the most other plasma sources.Application of the hollow cathode glow discharge for surface finish are technics like plasmacleaning, electron beam ablation or gas flow sputtering. Latters are new technics which allow the development of new sources for the coating technology.The application of the hollow cathode are discharge is possible by using the thermal energy generated by the electron beam (electron beam heating, electron beam melting, and electron beam evaporation) and by using the different possibilities of coating technologies whith the hollow cathode arc source (plasma enhanced evaporation, plasma enhanced reactive PVD and plasma CV

ISSN:0947-076X    

DOI:10.1002/vipr.19950070105

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractThe discovery of high‐temperature‐superconductors, which exhibit a transition temperature above 77 K, was supposed to be the best way to achieve superconductivity at room temperature. The research of the recent years turned out, that further problems have to be solved. Especially the layered structure of the new ceramic superconductors reveals in several drawbacks in the preparation techniques. The purpose of this article is to give a comprehensive overview about different preparation techniques of high temperature superconductors. A summary of their cryoelectronic applications will be presen

ISSN:0947-076X    

DOI:10.1002/vipr.19950070106

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractIn reactive processes a process gas is fed into the process chamber after evacuation. The most important precondition for a reproceable process is a stable process pressure.Pressure control is carried out either by controlling the gas flow on the gas inlet side or by regulating the effective pumping speed on the chamber output side.The application of the user determines, which of the two sysstms is best suited.Plasma enhanced etching and coating processes encounter a growing importance in the semiconductor industry. At the same time applications have expanded to improvement procedures of metallic surfaces and production of computer hard discs, based on plasma processes as reactive vapour deposition and sputtering.For many of these applications pressure control via the gas input is sufficient. But the increasing demands on the quality of the micro structures with modern surface processes can only be satisfied by independent control of the gas flow and the process pressure. Pressure control independent of the gas flow is achieved by controlling the effective pumping speed of the vacuum pump.The presented paper starts with the general theory of pressure control, and deals with the various aspects of pressure control, including downstream pressure control with throttle valvê, adaptive controller and sensor

ISSN:0947-076X    

DOI:10.1002/vipr.19950070107

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

ISSN:0947-076X    

DOI:10.1002/vipr.19950070108

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

ISSN:0947-076X    

DOI:10.1002/vipr.19950070109

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractThe article presents a theoretical model for calculating the gas flow through channels with moving walls in the molecular flow regime. The analytical equations are solved by iteration techniques. The calculated data for the pumping speed and the compression ration of a molecular pump are compared with the experimental results. The agreement between calculated and measured values is good.

ISSN:0947-076X    

DOI:10.1002/vipr.19950070110

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY

摘要:

AbstractA system for the measurement of the outgassing rate using the modified throughput method, the so‐called difference method, was completed by a sample heater to measure the outgassing of small metal samples at elevated temperatures. It was shown that by this modification the limitation of measuring range can be diminished up to two decades. The problems in similar measurement systems using hot filament ionization gauges are discussed in comparison to data acquired with partial pressure gauge

ISSN:0947-076X    

DOI:10.1002/vipr.19950070111

出版商:WILEY‐VCH Verlag    

年代:1995

数据来源: WILEY