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Influence of helium I layer formation on the copper‐helium‐4 Kapitza resistance at helium II bath temperatures

 

作者: Y. I. Kim,   Li‐He Lin,   C. Chuang,   T. H. K. Frederking,  

 

期刊: Applied Physics Letters  (AIP Available online 1983)
卷期: Volume 43, issue 5  

页码: 451-453

 

ISSN:0003-6951

 

年代: 1983

 

DOI:10.1063/1.94385

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The transient Kapitza resistance between copper and helium II caused by a step input in power has been studied near 2 K. The resistance is affected by formation of a helium I layer whose thickness, of the order 10−4–10−5cm, is evaluated as a function of the heat flux density.

 

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