Influence of helium I layer formation on the copper‐helium‐4 Kapitza resistance at helium II bath temperatures
作者:
Y. I. Kim,
Li‐He Lin,
C. Chuang,
T. H. K. Frederking,
期刊:
Applied Physics Letters
(AIP Available online 1983)
卷期:
Volume 43,
issue 5
页码: 451-453
ISSN:0003-6951
年代: 1983
DOI:10.1063/1.94385
出版商: AIP
数据来源: AIP
摘要:
The transient Kapitza resistance between copper and helium II caused by a step input in power has been studied near 2 K. The resistance is affected by formation of a helium I layer whose thickness, of the order 10−4–10−5cm, is evaluated as a function of the heat flux density.
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