Pattern recognition for automated wire bonding
作者:
H.F.Li,
C.M.Tsang,
Y.S.Cheung,
期刊:
IEE Proceedings E (Computers and Digital Techniques)
(IET Available online 1984)
卷期:
Volume 131,
issue 1
页码: 19-30
年代: 1984
DOI:10.1049/ip-e.1984.0004
出版商: IEE
数据来源: IET
摘要:
The design and development of an integrated pattern-recognition system for transistor/LED wire bonding is presented. The system uses a M6809 microprocessor for computation. Three recognition algorithms are studied extensively, and their relative performances are compared. The first algorithm based on edge extraction and projection is relatively slow but is a candidate for hardware implementation at higher speeds. The second algorithm based on the Freeman tracer is the fastest, but not intelligent enough to identify connected regions. A new algorithm called the ‘connected-tracer’ algorithm is proposed, which solves the problem of simple connectiveness with a speed performance of around 0.1 s using a 1 MHz processor. A variety of die samples of different sizes, scribing and attachment methods are tested. The results indicate that the system developed is both reliable and effective for fully automated transistor/LED wire bonding
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