An over-all system approach has been undertaken to make electron-beam microfabrication practical in a production environment at throughput rates which make it economically attractive to semiconductor manufacturers. An electron-beam system designed for fabrication of IC masks at final size in one step is described. Novel features include an ultrahigh-speed 16-bit digital deflection system, high-vacuum compatible x–y table and a field-emission source. System features described are single operator performance, multiple methods to input mask designs, high-speed deflection system, and (intelligent) beam logic interface and CAD system. The system is capable of producing 1.0-μ lines with ± 0.2-μ precision over a0.25×0.25-in.scan field with coverage of3×3-in.masks using step and repeat techniques. The system also includes an automated load-lock, cryopumped vacuum system and a high-speed 16-bit minicomputer. System parameters such as throughout time, writing speed, and factors affecting these parameters will be discussed.