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Automatic testing of MMIC wafers

 

作者: Inder Bahl,   Gary Lewis,   Jon Jorgenson,  

 

期刊: International Journal of Microwave and Millimeter‐Wave Computer‐Aided Engineering  (WILEY Available online 1991)
卷期: Volume 1, issue 1  

页码: 77-89

 

ISSN:1050-1827

 

年代: 1991

 

DOI:10.1002/mmce.4570010108

 

出版商: Wiley Subscription Services, Inc., A Wiley Company

 

数据来源: WILEY

 

摘要:

AbstractMicrowave probes are used extensively for linear and nonlinear characterization of microwave devices on wafer and are commercially available for use at frequencies up to 65 GHz. An on‐wafer noise measurement test system, for discrete devices, is now commercially available and on‐wafer power measurement techniques are emerging slowly. These probes are also getting more recognition for the testing of packaged chips, packages, and modules. More accurate calibration techniques and their on‐wafer validation are being developed. Automatic testing of MMIC wafers, using an integrated test system, is a key requirement for the development of low‐cost IC pro

 

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