Automatic testing of MMIC wafers
作者:
Inder Bahl,
Gary Lewis,
Jon Jorgenson,
期刊:
International Journal of Microwave and Millimeter‐Wave Computer‐Aided Engineering
(WILEY Available online 1991)
卷期:
Volume 1,
issue 1
页码: 77-89
ISSN:1050-1827
年代: 1991
DOI:10.1002/mmce.4570010108
出版商: Wiley Subscription Services, Inc., A Wiley Company
数据来源: WILEY
摘要:
AbstractMicrowave probes are used extensively for linear and nonlinear characterization of microwave devices on wafer and are commercially available for use at frequencies up to 65 GHz. An on‐wafer noise measurement test system, for discrete devices, is now commercially available and on‐wafer power measurement techniques are emerging slowly. These probes are also getting more recognition for the testing of packaged chips, packages, and modules. More accurate calibration techniques and their on‐wafer validation are being developed. Automatic testing of MMIC wafers, using an integrated test system, is a key requirement for the development of low‐cost IC pro
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