Beryllium windows joined by electroplating
作者:
H. R. Johnson,
J. W. Dini,
期刊:
Review of Scientific Instruments
(AIP Available online 1975)
卷期:
Volume 46,
issue 1
页码: 109-110
ISSN:0034-6748
年代: 1975
DOI:10.1063/1.1134047
出版商: AIP
数据来源: AIP
摘要:
Beryllium windows, 76 mm diam and 0.25 mm thick, were joined to stainless−steel flanges by electroplating the joint area with nickel. The procedures for surface preparation of both materials and the technique used for joining the materials with nickel are described. Electroplated joints made with this method have proved to be vacuum tight to helium. By using this technique, shrinkage stresses, distortion, and recrystallization problems associated with high−temperature joining processes are eliminated.
点击下载:
PDF
(150KB)
返 回