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Beryllium windows joined by electroplating

 

作者: H. R. Johnson,   J. W. Dini,  

 

期刊: Review of Scientific Instruments  (AIP Available online 1975)
卷期: Volume 46, issue 1  

页码: 109-110

 

ISSN:0034-6748

 

年代: 1975

 

DOI:10.1063/1.1134047

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Beryllium windows, 76 mm diam and 0.25 mm thick, were joined to stainless−steel flanges by electroplating the joint area with nickel. The procedures for surface preparation of both materials and the technique used for joining the materials with nickel are described. Electroplated joints made with this method have proved to be vacuum tight to helium. By using this technique, shrinkage stresses, distortion, and recrystallization problems associated with high−temperature joining processes are eliminated.

 

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