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Flyer plate adhesion tests for copper and nickel plated A286 stainless steel

 

作者: J. W. Dini,   H. R. Johnson,  

 

期刊: Review of Scientific Instruments  (AIP Available online 1975)
卷期: Volume 46, issue 12  

页码: 1706-1707

 

ISSN:0034-6748

 

年代: 1975

 

DOI:10.1063/1.1134149

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Flyer plate shock wave tests were used to evaluate the influence of using an intermediate copper electrodeposited coating on A286 stainless steel prior to plating to final thickness with nickel. Neither varying the copper plating solution (cyanide or pyrophosphate) nor the deposit thickness from 0.008 to 0.084 mm affected the adhesion as measured by this work.

 

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