Flyer plate adhesion tests for copper and nickel plated A286 stainless steel
作者:
J. W. Dini,
H. R. Johnson,
期刊:
Review of Scientific Instruments
(AIP Available online 1975)
卷期:
Volume 46,
issue 12
页码: 1706-1707
ISSN:0034-6748
年代: 1975
DOI:10.1063/1.1134149
出版商: AIP
数据来源: AIP
摘要:
Flyer plate shock wave tests were used to evaluate the influence of using an intermediate copper electrodeposited coating on A286 stainless steel prior to plating to final thickness with nickel. Neither varying the copper plating solution (cyanide or pyrophosphate) nor the deposit thickness from 0.008 to 0.084 mm affected the adhesion as measured by this work.
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