Direct metallic deposition exploits the advantages of electron-beam exposure for the production of fine structures and avoids the use of resists and chemical etching. The process involves the electron-induced decomposition of metallic compounds in areas precisely defined by an electron probe. In principle, the resistivity of the deposits formed by direct metallic deposition can be controlled by regulating the amount of molecular dissociation which takes place. To date, in experiments with silver chloride, deposits with submicron dimensions have been obtained. Typical sheet-resistance values of the deposits range from 10 to 1000 Ω/square for exposures varied from3×10−2to5×10−3 C/cm2. A Monte Carlo simulation of electron scattering in thin films on a supporting substrate has shown that the minimum deposit dimensions which can be expected from the process vary directly with film thickness and inversely with accelerating voltage. Experimental evidence is in agreement with the theoretical predictions.