AbstractThe application of computer‐aided manufacturing (CAM) techniques to the assembly and test of a low‐cost, high‐volume X‐band Radar T/R module will be investigated by highlighting the differences between low frequency and microwave CAM methods, focusing on the difficulties of automated testing, evaluation, and circuit tuning. The problems encountered when implementing high‐precision automated assembly and test methods, which include wire‐bonding, soldering, piece‐part placement, thin wafer GaAs probing, and a novel implementation of a microwave circuit laser‐tuning technique will also be discussed. These CAM techniques, combined with integrated MMIC technology, are then used to illustrate a manufacturing philosophy targeted toward high‐volume microwave