Effect of Direct Current on Precipitation in Quenched Al + 4% Cu Thin Films
作者:
M. C. Shine,
S. R. Herd,
期刊:
Applied Physics Letters
(AIP Available online 1972)
卷期:
Volume 20,
issue 6
页码: 217-219
ISSN:0003-6951
年代: 1972
DOI:10.1063/1.1654117
出版商: AIP
数据来源: AIP
摘要:
Resistance changes associated with precipitation in Al&sngbnd;Cu thin films were monitored during power annealing at current densities up to 4×106A/cm2and temperatures of ∼178 and 200 °C. The rate of change of resistance decreased as the current increased. It is argued that this decrease is due to the current inhibiting the precipitation of &thgr; Al2Cu.
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