Electromigration‐induced failure in NiCr thin‐film stripes is investigated. The composition of evaporated NiCr thin films is 77:23 Ni/Cr in weight %, according to a spectroscopic analysis. The mean time to failure (MTF) of NiCr thin‐film stripes can be qualitatively expressed by a relation similar to that held in the MTF of Al thin‐film stripes, i.e., MTF ∝J−nexp(&jgr;/kT). However, the values ofnand &jgr; of NiCr are 13 and 1.14 eV, respectively, whereas those of Al are 2 [inverted lazy s] 3 and 0.41 eV, respectively.