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ADHESION STRENGTH OF ELECTROLESS NICKEL DEPOSITS ON ALUMINA CERAMIC SUBSTRATE

 

作者: H. Honma,   T. Komatsuzawa,  

 

期刊: Advanced Materials and Manufacturing Processes  （Taylor Available online 1988）
卷期: Volume 3, issue 2  

页码: 291-308

 

ISSN:0898-2090

 

年代: 1988

 

DOI:10.1080/10426918808953208

 

出版商: Taylor & Francis Group

 

数据来源: Taylor

 

摘要:

Alumina ceramics are. widely used for LSI packages and printed circuit and sensor materials. For many of these applications, metallization of the surface is required. In general,this is performed by applying a conductive paste on the ceramic surface

 

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