A mechanical decapsulation technique for epoxide‐packaged semiconductor components
作者:
E. J. Chwastek,
I. A. Holland,
期刊:
Quality and Reliability Engineering International
(WILEY Available online 1988)
卷期:
Volume 4,
issue 1
页码: 7-10
ISSN:0748-8017
年代: 1988
DOI:10.1002/qre.4680040106
出版商: Wiley Subscription Services, Inc., A Wiley Company
关键词: Semiconductors;Failure analysis;Plastic encapsulation
数据来源: WILEY
摘要:
AbstractA novel mechanical technique for decapsulating plastic semiconductor components has been developed. The technique is extremely easy to use, has a high success rate, and is superior in all respects to previously‐described mechanical techniques which give inconsistent results. A significant advantage over alternative chemical techniques is that corrosion products on the die surface are retained.This paper describes the new technique and shows examples of new and corroded components that have been successfully decapsulate
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