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(LCCs) R&M Implications of leadless chip carriers

 

作者: H. E. Fox,  

 

期刊: Quality and Reliability Engineering International  （WILEY Available online 1987）
卷期: Volume 3, issue 1  

页码: 25-32

 

ISSN:0748-8017

 

年代: 1987

 

DOI:10.1002/qre.4680030106

 

出版商: Wiley Subscription Services, Inc., A Wiley Company

 

关键词: Surface mounting;Leadless chip carriers;Electronics reliability and maintainability

 

数据来源: WILEY

 

摘要:

AbstractThe current state‐of‐the‐art regarding LCCs is reviewed in terms of published papers concerning LCC applications, device reliability and attachment techniques. Reliability uncertainties relating to environment, size and attachment geometry are identified. An extensive bibliography is inc

 

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