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A refractory lift‐off process with applications to high‐Tcsuperconducting circuits

 

作者: R. E. Howard,  

 

期刊: Applied Physics Letters  （AIP Available online 1978）
卷期: Volume 33, issue 12  

页码: 1034-1035

 

ISSN:0003-6951

 

年代: 1978

 

DOI:10.1063/1.90258

 

出版商: AIP

 

数据来源: AIP

 

摘要:

A refractory stencil lift‐off process utilizing Nb/Cu bilayers is described that is suitable for materials, such as the high‐transition‐temperature superconductors, which must be deposited on hot (up to 1000 °C) substrates.

 

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