Techniques forin-situmeasurement of electrical bonding on aircraft structures
作者:
K.J.Lodge,
M.W.Baskerville,
期刊:
Journal of the Institution of Electronic and Radio Engineers
(IET Available online 1985)
卷期:
Volume 55,
issue 5
页码: 165-171
年代: 1985
DOI:10.1049/jiere.1985.0051
出版商: IERE
数据来源: IET
摘要:
Methods of measuring electrical bonding of large, complex structures such as aircraft are discussed. The importance of measurement method design and result interpretation are stressed. The methods which are described are either large scale, such as potential plotting, potential mapping and infra-red scanning, or examine a small area, such as the resistance of individual fasteners. These methods have all been usedin situon service aircraft or large mock-ups. The limitations on the measurement methods are pointed out and the potential uses of the results, to predict poor bonding areas, set specifications etc., suggested.
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