An experimental technique has been developed at McDonnell Douglas Corporation (MDC) that can be used to derive the shearing stress-strain distribution in an adhesive-bonded joint and therefore its shear modulus. The MDC technique uses a double-lap joint model instrumented with either photostress coatings or strain gauges. The technique was used to determine the effects of different bond thickness on the stress-strain behavior of an epoxy adhesive and the effect of a cryogenic environment on the stress-strain characteristics of a polyurethane adhesive.