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Electron Beam Testing of Circuit Interconnections using Collector Stabilized Conductor Charging

 

作者: J. M. Sebeson,  

 

期刊: Journal of Vacuum Science and Technology  (AIP Available online 1973)
卷期: Volume 10, issue 6  

页码: 1060-1063

 

ISSN:0022-5355

 

年代: 1973

 

DOI:10.1116/1.1318467

 

出版商: American Vacuum Society

 

数据来源: AIP

 

摘要:

A noncontact procedure for sensing continuity and isolation faults in large, dense interconnection patterns by means of selective deposition of charge by an electron beam is proposed and discussed. When the accelerating potential is properly chosen, a marked variation in the secondary electron signal occurs during the charging of an electrically floating element to an equilibrium potential. This phenomenon forms the basis of the method. A laboratory system has been constructed to demonstrate the procedure. Results obtained indicate agreement with the basic theory and demonstrate the application of the technique to continuity and isolation testing of conductor films. Electron-beam testing has a clear advantage over mechanical-probe testing in terms of speed and flexibility. The less attractive features include the need for a vacuum system and the inability to detect continuity faults when the fault resistance is less than about one megohm.

 

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